Joel Auernheimer
Education
- Master of Science in Electrical Engineering from Arizona State University, December 2000.
- Bachelor of Science with highest honors (summa cum laude) in Electrical Engineering from Arizona State University, May 1999 (3.96 GPA).
Work Experience:
Intel Corporation:
Analog Engineer, August 2005 to present; Electrical Design and Analysis / Packaging and Interconnects; Chandler, Arizona.
- Managed and performed power integrity analyses for Xeon and Itanium platforms
- Developed automation to support power integrity analyses and related processes
Signal Integrity Engineer, May 2004 to August 2005; Signal Integrity Team / Packaging and Interconnects; Chandler, Arizona.
- Managed PCI-Express projects and analysis for various enterprise platforms
Package Design Engineer, January 2001 to May 2004; Substrate Design Engineering / Assembly Technology Development; Chandler, Arizona.
- Substrate Design Engineering Desktop/Chipsets Manager
- Responsible engineer for various desktop and chipset packages, including Pentium IV packages
- Worked closely with a multi-disciplinary, cross-platform team to create high-performance, low-cost solutions for these packages
- Performed physical design, electromagnetic modeling, computer simulation, signal integrity, and power delivery optimization using novel methods and application of electromagnetic field solvers, circuit simulators, and transmission line theory
- Developed and transferred methodology to partners in desktop, enterprise, and mobile design teams
- Coordinated resources using project management software
- Participated in and led design efforts for various pathfinding products
Mayo Foundation:
Engineering Co-op, Summers of 1997, 1999, 2000; Special Purpose Processor Development Group; Rochester, Minnesota.
- Performed verification and studies of the w-element model (HSPICE) and a PSPICE model developed at Arizona State University
- Developed graphical user interfaces for engineering and lab software
- Analyzed and applied time-domain reflectometry methods and models with parasitics information to determine the differences between Tektronic and Polar network analyzers
- Developed mathematical methods, deembedding techniques, and code to convert S-parameters to transmission line parameters (RLCG)
Arizona State University:
Undergraduate Research Assistant, August 1997 to July 1999; Electronics Packaging Lab; Tempe, Arizona.
Graduate Research Associate, August 1999 to May 2000.
- Computer simulation and electromagnetic modeling of transmission lines
- Developed an adaptive meshing scheme for improving Weeks’ method for computing frequency-dependent impedance of conductors
- Studied and characterized signal integrity problems with an SMA connector launch off of a printed circuit board (subcontract with Motorola)
- Developed and coded a transmission line model with full control of frequency-dependent parameters for time- and frequency-domain analysis
Selected Academic Awards:
- University Graduate Fellowship
- Distinguished Senior in Electrical Engineering
- National Science Foundation Graduate Fellowship Honorable Mention
- Goldwater Science and Engineering Scholarship
Industry Recognitions:
- Young Engineer of the Year (IEEE Phoenix Chapter, 2008)
- Senior Member of the IEEE (2009)
Skills:
- General: Computer simulation, microwave circuit design, electromagnetic modeling, transmission line analysis, package design, simultaneous-switching noise, signal integrity, application development, software engineering, programming, project management
- Languages: C/C++, Java, VB, VBA, Perl, shell scripting, HTML, CSS, Python, PHP
- Software: Cadence tools (Advanced Package Designer (APD), Allegro), Ansoft tools (Q3D, HFSS), Matlab, HSPICE, LaTeX, PSPICE, Microsoft Office (Excel, PowerPoint, Word, Outlook, Project), Visio, Sharepoint
- Operating Systems: UNIX, Linux, Windows
Publications:
- Xingling Zhou, Joel Auernheimer, George Pan, and Barry Gilbert: “An Improved SPICE Compatible Model for Multiconductor Transmission Lines.” Published in IEEE CEFC ’98 The Eighth Biennial IEEE Conference on Electromagnetic Field Computation, June 1-3, 1998 in Tucson, Arizona, p. 363. (Abstract)
- Joel A. Auernheimer, “Streamlined Methods for Power Delivery Simulations,” Design and Test Technology Conference (Intel internal conference), July 2002.
- Joel A. Auernheimer and Farzaneh Yahyaei-moayyed, “Efficient and Flexible Power Distribution System Design and Analysis,” Design and Test Technology Conference (Intel internal conference), July 2003.
- Joel A. Auernheimer, “New Methods for Power Distribution System Design and Analysis,” Electronic Components and Technology Conference, June 2004.
Patents:
- Flex tape architecture for integrated circuit signal ingress/egress
- Array capacitor with resistive structure
- Array capacitor for decoupling multiple voltage rails
- Forming a substrate core with embedded capacitor and structures formed thereby
- Land grid array with socket plate
- Array capacitors for broadband decoupling applications
- Two other patents pending